Standard CMOS process technology can be used for radio components to meet the challenge of seamless wireless connectivity. Intel is working on integration of multiple radio frequency (RF) circuits and systems onto one silicon die. Intel is now applying the same scale and cost advantages of microprocessors and chipsets for miniaturization, integration, and evolution of RF circuitry that could support new abilities, including the agile radio and the ability to provide cost-effective solutions for seamless connectivity. Intels research into radio includes research into microelectromechanical sensors/systems (MEMS)-enabled reconfigurable RF front-end devices through matching of networks and filters for agile radio applications, smart antennas, and advanced process technology. Intel is also looking at the most efficient packaging for integration of multiple reconfigurable radio components, including MEMS and CMOS, into one standard application specific integrated circuit (ASIC). To address issues of regulation, Intel is closely working with the U.S., European, and Japanese regulatory authorities to adjust guidelines for agile radio technology. With Intel's economical, high-volume standard CMOS processes, wireless connectivity could soon be universally available and more efficient for almost seamless end-user support. Such methods as ARA (adaptive radio architecture) and smart antennas may soon become available to enable such new abilities as agile and cognitive radio.