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Article

Title: IBM Corp.'s Nanotechnology For Semiconductor Processing

Author: Stevens, Tim Article Type: Product Analysis
Source: Industry Week, v253 n12 p35(2) Publication Date: Dec 2004
  ISSN: 0039-0895
URL of Publication: http://www.industryweek.com

A discussion of IBM nanotechnology for semiconductor processing provides a timeline for development that began in 2003 and proceeds through 2004, during which IBM made a decoupling capacitor that occupies one-quarter the space the devices take up on current microprocessors. Another important development occurred in March 2004, when IBM researchers figured out how to use polymer self-assembly in a way to create more ordered structures that permit construction of much more complex electronics, including memory arrays and microprocessors. Self-assembling polymers generate masks that perform as stencils to create the tiny in-and-out patterns on silicon wafers. However, polymer acts at the molecular level to create much finer stencils. To create polymers that can assemble themselves, IBM researchers connect two different long-chain polymers to form a co-polymer. The long strands will not mix, and, when a co-polymer is applied to a surface, the different strands attempt to minimize the areas that touch. A compromise based on polymer ratio, film thickness, and environmental conditions, generates films with different ordered patterns. These ordered patterns are acceptable for the internal workings of specific devices, and IBM has also discovered that it can control position and orientation of the patterns.

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Nanotechnology Semiconductors

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