Newsletter Signup
Where current and emerging technology trends meet.
TecTrendsInformation Sources, Inc.
  | About TecTrends | Email Signup | Contact Us
 Live Search:
Live Search | Articles | Companies | TecTerms | Products
  Loading TecTrends Live Search - please wait... 
View Noteworthy Articles      PRNewswire
 
Article

Title: Lab develops failsafe methods to improve MEMS reliability

Author: Karoub, Jeff Article Type: Product Analysis
Source: Smalltimes, v4 n1 p26(1) Publication Date: Jan/Feb 2004
  ISSN: 1536-7673
  Illustrations: Output Samples; Charts
URL of Publication: http://www.smalltimes.com

Sandia National Laboratories' Sandia High-volume Micromachine Measurement of Reliability (ShiMMeR) is a testing system with a base for testing up to 256 microelectromechanical systems (MEMS) parts at a time and a high-power microscope and video camera for observation and recording failures. The research group's aim is to find out what the consequences are when a MEMS device fails. ShiMMeR is used to run devices until they break. A cross section is then cut through the gears with a focused-ion beam. The pieces are viewed through a microscope. The view helps researchers determine just what made the microdevices fail and when and where failures take place. The group also develops physics-based models for predicting when parts fail. Strength, adhesive wear, critical volume, applied force, and other factors are tested and evaluated. Since the late 1990's, ShiMMeR has allowed researchers to approach their studies from the perspective of the physics of failure mentality and what the actual science involved is. Recently, Danielle Tanner and her team at Sandia have changed the original machine and build a second version to blend testing environments, including humidity and high or low temperatures. Sandia benefits the industry with 'basic understanding of failure mechanisms' and publishes as many of its results as possible to assist others in research and development (R&D).

Special Features: Output Samples; Charts

Products:
Failure Analyses MicroElectroMechanical Systems

TecTerms:


[Get Copyright Permissions] Click here for copyright permissions!
Copyright 2004-2008 Information Sources Inc.
 


Home About TecTrends About Us Contact Us Privacy Statement Terms and Conditions

TecTrends | P.O. Box 8120 | Berkeley CA 94707 | (510) 525-6220 | Email: tectrends@tectrends.com
© 2006 INFORMATION SOURCES INC | All rights reserved.